Information travels fast. Core networking equipment has not always required such agile memory, but with the advancement of networking technologies and the advent of triple play, specialized memory is a must. With JEDEC and AdvancedTCA®-compatible heights, Micron's very low profile small-outline registered DIMMs (VLP SORDIMMs) are designed to improve airflow and to adhere to the size constraints of compact networking devices.
Micron VLP SORDIMMs also feature bits for error correction code (ECC), which increases data reliability. This device is also available with an increased temperature operating range, enabling the modules to operate in the extreme environments of complicated and large communication networks.
Micron understands the needs of networking applications, and as part of our networking focus, Micron works closely with customers and enablers to identify specific industry requirements. We have a broad portfolio of specialized memory products to enable the networking industry now and in the future.
VLP SORDIMM Part Catalog and Documentation
Networking Applications
The unique requirements of communications and networking applications—low latency, rigorous footprint and thermal specifications, and pristine signal integrity—demand specific memory solutions. Micron's leading networking portfolio caters to the needs of this market with products designed specifically for the space, latency, and extreme temperature challenges designers face. Recent additions of extended temperature devices, very low-profile modules, and Pb-free options further expand the portfolio—the broadest array of memory solutions for new and installed-based customers and equipment.
Micron's RLDRAM® memory, VLP MiniRDIMMs, VLP SORDIMMs, SORDIMMs, SOCDIMMs, FBDIMMs, and full DRAM line offer compelling solutions that meet the performance needs of these applications.
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