Micron's DDR Designer's Toolbox
DDR Unbuffered DIMM Design Files and Configurations
Notice: Module builds should be done using the
current Gerber release. The "Proposed Specification Changes
and Additions" highlighted on this Web site are for information
purposes only and should not be implemented in PCB builds until
the changes are incorporated into the corresponding design release.
Raw Card Version |
DIMM Capacity |
DIMM Organization |
SDRAM Density |
SDRAM Organization |
# SDRAMs |
# Banks (DIMM) |
Address Bits row/col/banks |
A0
Raw
Card A is a single-bank, single-sided PCB for use with
x8 DDR SDRAM components. It has the advantage over the
Raw Card B "depopulated" single-bank in
that it will be a single-pass assembly (all components
are on a single-side of the PCB). In addition to the cost-saving
potential, the reason for a specific single-bank design is
to improve address/command bus arrival time skews between
different module mixes. This will improve system timing budget
margins.
|
64MB |
8 Meg x 64 |
64Mb |
8 Meg x 8 |
8 |
1 |
12/9/2 |
| 128MB |
16 Meg x 64 |
128Mb |
16 Meg x 8 |
8 |
1 |
12/10/2 |
| 256MB |
32 Meg x 64 |
256Mb |
32 Meg x 8 |
8 |
1 |
13/10/2 |
| 512MB |
64 Meg x 64 |
512Mb |
64 Meg x 8 |
8 |
1 |
13/11/2 |
| 64MB + ECC |
8 Meg x 72 |
64Mb |
8 Meg x 8 |
9 |
1 |
12/9/2 |
| 128MB + ECC |
16 Meg x 72 |
128Mb |
16 Meg x 8 |
9 |
1 |
12/10/2 |
| 256MB + ECC |
32 Meg x 72 |
256Mb |
32 Meg x 8 |
9 |
1 |
13/10/2 |
| 512MB + ECC |
64 Meg x 72 |
512Mb |
64 Meg x 8 |
9 |
1 |
13/11/2 |
Raw Card Version |
DIMM Capacity |
DIMM Organization |
SDRAM Density |
SDRAM Organization |
# SDRAMs |
# Banks (DIMM) |
Address Bits row/col/banks |
|
Project: Unbuffered Raw Card B (x8-based dual-bank x64/x72)
Released Version B0 - Changes
for revision (B1), released in March 2000
-
Fine-tuned clock lines to tighten skew.Lengths matched
to 1mil
-
Fine-tuned clock lines to reduce or remove low grade
crosstalk
-
Fine-tuned data nets to matched length tolerance of
1mil
-
Modified outline_pg1.ps drawing to allow component
placement above end notches according to JEDECstandards
-
Converted VREF to VDD bypass to VREF to VSS
-
Changed C22 to a VREF to VSS bypass
-
Increased trace widths on all VDD and VSS traces
-
Changed via pad size to 0.022" and
antipad size to 0.032"
-
Removed EEPROM WP signal
|
64MB |
8 Meg x 64 |
64Mb |
8 Meg x 8 |
8 |
1* |
12/9/2 |
| 128MB |
16 Meg x 64 |
128Mb |
16 Meg x 8 |
8 |
1* |
12/10/2 |
| 256MB |
32 Meg x 64 |
256Mb |
32 Meg x 8 |
8 |
1* |
13/10/2 |
| 512MB |
64 Meg x 64 |
512Mb |
64 Meg x 8 |
8 |
1* |
13/11/2 |
| 64MB + ECC |
8 Meg x 72 |
64Mb |
8 Meg x 8 |
9 |
1* |
12/9/2 |
| 128MB + ECC |
16 Meg x 72 |
128Mb |
16 Meg x 8 |
9 |
1* |
12/10/2 |
| 256MB + ECC |
32 Meg x 72 |
256Mb |
32 Meg x 8 |
9 |
1* |
13/10/2 |
| 512MB + ECC |
64 Meg x 72 |
512Mb |
64 Meg x 8 |
9 |
1* |
13/11/2 |
| 128MB |
16 Meg x 64 |
64Mb |
8 Meg x 8 |
16 |
2 |
12/9/2 |
| 256MB |
32 Meg x 64 |
128Mb |
16 Meg x 8 |
16 |
2 |
12/10/2 |
| 512MB |
64 Meg x 64 |
256Mb |
32 Meg x 8 |
16 |
2 |
13/10/2 |
| 1GB |
128 Meg x 64 |
512Mb |
64 Meg x 8 |
16 |
2 |
13/11/2 |
| 128MB + ECC |
16 Meg x 72 |
64Mb |
8 Meg x 8 |
18 |
2 |
12/9/2 |
| 256MB + ECC |
32 Meg x 72 |
128Mb |
16 Meg x 8 |
18 |
2 |
12/10/2 |
| 512MB + ECC |
64 Meg x 72 |
256Mb |
32 Meg x 8 |
18 |
2 |
13/10/2 |
| 1GB + ECC |
128 Meg x 72 |
512Mb |
64 Meg x 8 |
18 |
2 |
13/11/2 |
Raw Card Version |
DIMM Capacity |
DIMM Organization |
SDRAM Density |
SDRAM Organization |
# SDRAMs |
# Banks (DIMM) |
Address Bits row/col/banks |
|
Implemented: Unbuffered Raw Card
C2
This release added series stub resistors
for the C/A signals and incorporated design changes based
on feedback and hardware analysis of Raw Card C1
-
Added 7.5 ohm series resistors to command and address
signals*
-
Added copper fill to unrouted areas on the signal layers
-
Added four SDRAM decoupling caps
-
Added a VDDSPD decoupling cap and increased trace width
-
Moved DQS traces from L3 and L4 to the secondary side
for consistency
* Note: This is a long leadtime item.
One supplier currently tooling this pack is Bourns--part
number: CAY10-7R40F2 |
32MB |
4 Meg x 64 |
64Mb |
4 Meg x 16 |
4 |
1 |
12/8/2 |
| 64MB |
8 Meg x 64 |
128Mb |
8 Meg x 16 |
4 |
1 |
12/9/2 |
| 128MB |
16 Meg x 64 |
256Mb |
16 Meg x 16 |
4 |
1 |
13/9/2 |
| 256MB |
32 Meg x 64 |
512Mb |
32 Meg x 16 |
4 |
1 |
13/10/2 |
| 32MB + ECC |
4 Meg x 72 |
64Mb |
4 Meg x 16 |
5 |
1 |
12/8/2 |
| 64MB + ECC |
8 Meg x 72 |
128Mb |
8 Meg x 16 |
5 |
1 |
12/9/2 |
| 128MB + ECC |
16 Meg x 72 |
256Mb |
16 Meg x 16 |
5 |
1 |
13/9/2 |
| 256MB + ECC |
32 Meg x 72 |
512Mb |
32 Meg x 16 |
5 |
1 |
13/10/2 |
Previous Revisions B0
C0 C1
* Raw Card B may be depopulated to a single-bank
DIMM; however, it is recommended (and encouraged) that Raw Card
A be used for single-bank, x8-based DIMMs.